Development of conductive adhesive materials for via fill...

IEEE Transactions on Components and Packaging Technologies 2001 / Sept. Vol. 24; Iss. 3

Development of conductive adhesive materials for via fill applications

Kang, S.K., Buchwalter, S.L., LaBianca, N.C., Gelorme, J., Purushothaman, S., Papathomas, K., Poliks, M.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.946490
Date:
January, 2001
File:
PDF, 96 KB
english, 2001
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