Integrated Liquid Cooling Systems for 3-D Stacked TSV...

IEEE Transactions on Components and Packaging Technologies 2010 / 03 Vol. 33; Iss. 1

Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Tang, Gong Yue, Tan, Siow Pin, Khan, Navas, Pinjala, D., Lau, John H., Yu, Ai Bin, Vaidyanathan, Kripesh, Toh, Kok Chuan
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Volume:
33
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2033039
Date:
March, 2010
File:
PDF, 1.78 MB
english, 2010
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