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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - GTL high speed I/O in 3D ICs for TSV and interconnect signal integrity characterization
Baek, Hyunho, Harb, Shadi, Eisenstadt, William R.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248932
File:
PDF, 1.70 MB
english, 2012