Noncontact transient temperature mapping of active...

IEEE Transactions on Components and Packaging Technologies 2005 / 12 Vol. 28; Iss. 4

Noncontact transient temperature mapping of active electronic devices using the thermoreflectance method

Burzo, M.G., Komarov, P.L., Raad, P.E.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.859738
Date:
December, 2005
File:
PDF, 932 KB
english, 2005
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