Comprehensive Study on the Interactions of Multiple Die...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 6 Vol. 4; Iss. 6

Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages

Ling, Ho Siow, Lin, Bu, Choong, Chong Ser, Velez, Sorono Dexter, Chong, Chai Tai, Zhang, Xiaowu
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2316019
Date:
June, 2014
File:
PDF, 3.01 MB
english, 2014
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