150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging...

IEEE Transactions on Advanced Packaging 2008 / 02 Vol. 31; Iss. 1

150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects

Seung Wook Yoon,, Thew, S.M.L., Lim, S.Y.L., Wai Yin Hnin,, Tai Chong Chai,, Viswanath, A.G.K., Kripesh, V.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2008.916296
Date:
February, 2008
File:
PDF, 1.45 MB
english, 2008
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