[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China...

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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of the fundamental interactions among the ingredients of flux by the group contribution method

Jin, Yunxia, Hu, Jun, Lu, Daniel
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Year:
2009
Language:
english
DOI:
10.1109/icept.2009.5270551
File:
PDF, 443 KB
english, 2009
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