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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Recent progress in the studies of low melting Sn-based Pb-free solders
Lin, Yang, Yin, Luqiao, Wei, XichengYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066847
File:
PDF, 1.03 MB
english, 2011