Correction to "High-temperature, low-modulus adhesive...

IEEE Transactions on Electronics Packaging Manufacturing 2000 / 04 Vol. 23; Iss. 2

Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"

Varyiyam, M., Sundararaman, V., Sitaraman, S.K., Wu, J., Pike, R.T., Wong, C.P.
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Volume:
23
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2000.846938
Date:
April, 2000
File:
PDF, 5 KB
2000
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