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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Optimal packing research of spherical silica fillers used in epoxy molding compound
Mei, Hujie, Du, Xinyu, Li, Lanxia, Tan, WeiYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270673
File:
PDF, 947 KB
english, 2009