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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Novel assembly framework of bi-layered molding materials for 3D-ICs packaging
Lee, Chang-Chun, Tzeng, Tzai-Liang, Lai, Yi-Jing, Lin, Yu-Min, Zhan, Chau-Jie, Chang, Tao-ChihYear:
2013
Language:
english
DOI:
10.1109/impact.2013.6706648
File:
PDF, 930 KB
english, 2013