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[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Reducing lead-free soldering failures caused by Printed Circuit Board shrinkage
Geczy, A., Tersztyanszky, L., Illes, B., Kemler, A., Szabo, A.Year:
2013
Language:
english
DOI:
10.1109/siitme.2013.6743645
File:
PDF, 781 KB
english, 2013