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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Fabrication and characterization of epoxy/BaTiO3 composite embedded capacitor for high frequency behaviors
Jin-Gul Hyun,, Kyung-Wook Paik,, Jun So Pak,Year:
2008
Language:
english
DOI:
10.1109/emap.2008.4784245
File:
PDF, 3.98 MB
english, 2008