[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Wafer Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
Yu, Daquan, Yan, Liling, Lee, Chengkuo, Choi, Won Kyoung, Thew, Meei Ling, Fool, Chin Keng, Lau, John HYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763525
File:
PDF, 6.25 MB
english, 2008