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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electromigration of solder balls for wafer-level packaging with different under bump metallurgy and redistribution layer thickness
Hau-Riege, Christine, Keser, Beth, Yau, You-Wen, Bezuk, SteveYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575651
File:
PDF, 1.09 MB
english, 2013