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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Numerical analysis of moisture diffusion in composite resins containing multiple particles using hybrid moisture element method
Liu, De-Shin, Zhuang, Zhen-Wei, Lin, I-HungYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699655
File:
PDF, 137 KB
english, 2010