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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
Nah, Jae-Woong, Gelorme, Jeffrey, Sorce, Peter, Lauro, Paul, Perfecto, Eric, McLeod, Mark, Toriyama, Kazushige, Orii, Yasumitsu, Brofman, Peter, Nauchi, Takashi, Takaguchi, Akira, Ishiguro, Kazuya, YoYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897461
File:
PDF, 2.55 MB
english, 2014