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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - The simplest modification of Cu diffusion barrier dielectrics to improve Cu/Low-k interconnects reliability
Goto, Kinya, Oka, Yoshihiro, Suzumura, Naohito, Shibata, Ryuji, Furuhashi, Takahisa, Matsumoto, Masahiro, Kawamura, Takeshi, Matsuura, Masazumi, Fujisawa, Masahiko, Asai, KoyuYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940357
File:
PDF, 282 KB
english, 2011