[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Distributed on-chip power grid modeling: an electromagnetic alternative to RLC extraction-based models
Jae-Yong Ihm,, Cangellaris, A.C.Year:
2003
Language:
english
DOI:
10.1109/epep.2003.1249995
File:
PDF, 259 KB
english, 2003