[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Process integration of solder bumps and Cu pillar microbumps on 2.5D fine pitch TSV interposer
Pei-Siang, Sharon Lim, Ding, L., Yu, MingBin, Ding, Mian Zhi, Dexter Velez, Sorono, Rao, Vempati SrinivasaYear:
2013
DOI:
10.1109/eptc.2013.6745756
File:
PDF, 838 KB
2013