[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 26.6 A 2.667Gb/s DDR3 memory interface with asymmetric ODT on wirebond package and single-side-mounted PCB

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