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[IEEE 2006 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu (2006.04.24-2006.04.26)] 2006 International Symposium on VLSI Technology, Systems, and Applications - A Novel Deep Trench Isolation Featuring Airgaps for a High-Speed 0.13μm SiGe:C BiCMOS Technology
Choi, L.J., Kunnen, E., Van Huylenbroeck, S., Piontck, A., Sibaja-Hemandez, A., Vleugels, F., Dupont, T., Leray, P., Devriondt, K., Shi, X.P., Loo, R., Vanhaelemeersch, S., Decoutere, S.Year:
2006
Language:
english
DOI:
10.1109/vtsa.2006.251079
File:
PDF, 2.00 MB
english, 2006