[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Development of three-dimensional multichip module based on embedded substrate with multiple interconnections
Gaowei Xu,, Yanhong Wu,, Fei Geng,, Qiuping Huang,, Jian Zhou,, Le Luo,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4606955
File:
PDF, 1.32 MB
english, 2008