[IEEE 2010 Proceedings 60th Electronic Components and...

  • Main
  • [IEEE 2010 Proceedings 60th Electronic...

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Spiral via structure in a BGA package to mitigate discontinuities in multi-gigabit SERDES system

Kim, Namhoon, Ahn, Hongsik, Wyland, Chris, Anderson, Ray, Wu, Paul
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490803
File:
PDF, 689 KB
english, 2010
Conversion to is in progress
Conversion to is failed