[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Process integration and testing of TSV Si interposers for 3D integration applications
Lannon, J., Hilton, A., Huffman, A., Lueck, M., Vick, E., Goodwin, S., Cunningham, G., Malta, D., Gregory, C., Temple, D.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248839
File:
PDF, 859 KB
english, 2012