[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electromigration reliability and current carrying capacity of various WLCSP interconnect structures
Syed, Ahmer, Dhandapani, Karthikeyan, Berry, Christopher, Moody, Robert, Whiting, RikiYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575652
File:
PDF, 2.99 MB
english, 2013