[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish
Syed, Ahmer, Kim, Tae, Cho, Young, Kim, Chang, Yoo, MinYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342750
File:
PDF, 383 KB
english, 2006