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[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - Isotropically conductive adhesives and solder bumps for flip chip on board circuits-a comparison of lifetime under thermal cycling
Nysaether, J.B., Lai, Z., Liu, J.Year:
1998
Language:
english
DOI:
10.1109/adhes.1998.742014
File:
PDF, 860 KB
english, 1998