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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film
Kuo-Shu Kao,, Ren-Shin Cheng,, Chau-Jie Zhan,, Chang, Jing-Yao, Tsung-Fu Yang,, Shin-Yi Huang,, Chia-Wen Fan,, Su-Mei Chen,, Su-Ching Chung,, Yu-Lan Lu,, Mei-Lun Wu,, Tai-Hung Chen,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420249
File:
PDF, 2.29 MB
english, 2012