[IEEE 2007 International Conference on Electronic Materials...

  • Main
  • [IEEE 2007 International Conference on...

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - QFN assembly dilemma - solutions

Tan Chee Eng,, Pan Yen Jeat,, Chin Meei Lian,, Chin Lap Sin,, Fonseka, Geale
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510275
File:
PDF, 1.42 MB
english, 2007
Conversion to is in progress
Conversion to is failed