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[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - QFN assembly dilemma - solutions
Tan Chee Eng,, Pan Yen Jeat,, Chin Meei Lian,, Chin Lap Sin,, Fonseka, GealeYear:
2007
Language:
english
DOI:
10.1109/emap.2007.4510275
File:
PDF, 1.42 MB
english, 2007