[IEEE Advances in Electronic Materials and Packaging 2001 -...

  • Main
  • [IEEE Advances in Electronic Materials...

[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - High- reliability nonconductive adhesives for flip chip interconnections

Woon-Seong Kwon,, Kyung-Woon Jang,, Kyung-Wook Paik,, Myung-Jin Yim,, Jin-Sang Hwang,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2001
Language:
english
DOI:
10.1109/emap.2001.983954
File:
PDF, 451 KB
english, 2001
Conversion to is in progress
Conversion to is failed