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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - High- reliability nonconductive adhesives for flip chip interconnections
Woon-Seong Kwon,, Kyung-Woon Jang,, Kyung-Wook Paik,, Myung-Jin Yim,, Jin-Sang Hwang,Year:
2001
Language:
english
DOI:
10.1109/emap.2001.983954
File:
PDF, 451 KB
english, 2001