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[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern
Fuliang Wang,, Junhui Li,, Lei Han,, Jue Zhong,Year:
2006
Language:
english
DOI:
10.1109/hdp.2006.1707571
File:
PDF, 290 KB
english, 2006