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[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Analysis of thermal-moisture induced failure of Pb-free soldered IC packages in SMT reflow soldering process
Ning Sun,, Dachuan Lin,, Daoguo Yang,Year:
2004
Language:
english
DOI:
10.1109/esime.2004.1304061
File:
PDF, 637 KB
english, 2004