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The effect of area ratio on the flow distribution in liquid cooling module manifolds for electronic packaging
Steve H. Choi, Sehyun Shin, Young I. ChoVolume:
20
Year:
1993
Language:
english
Pages:
14
DOI:
10.1016/0735-1933(93)90050-6
File:
PDF, 465 KB
english, 1993