![](/img/cover-not-exists.png)
[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Comprehensive process design for low-cost chip packaging with circuit-under-pad (CUP) structure in porous-SiOCH film
Tagami, M., Ohtake, H., Abe, M., Ito, F., Takeuchi, T., Ohto, K., Usami, T., Suzuki, M., Suzuki, T., Sashida, N., Hayashi, Y.Year:
2005
Language:
english
DOI:
10.1109/iitc.2005.1499905
File:
PDF, 552 KB
english, 2005