[IEEE 4th Electronics Packaging Technology Conference (EPTC...

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[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Reliability assessment of high density multi-layer board assembly using shadow Moire and luminescence spectroscopy

Bansal, S., Markondeya Raj, P., Shinotani, K., Bhattacharya, S., Tummala, R., Lance, M.J.
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Year:
2002
Language:
english
DOI:
10.1109/eptc.2002.1185610
File:
PDF, 715 KB
english, 2002
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