[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - IC chip crack issues due to mounting process for ultra-thin IC smart card module
Pingyue Fan,, Jiaji Wang,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607124
File:
PDF, 1.13 MB
english, 2008