[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Drop impact life prediction model for lead-free BGA packages and modules
Jing-en Luan,, Tong Yan Tee,, Kim Yong Goh,, Hun Shen Ng,, Baraton, X., Brenner, R., Sorricul, M.Year:
2005
Language:
english
DOI:
10.1109/esime.2005.1502867
File:
PDF, 1.34 MB
english, 2005