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[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization
Dubin, V.M., Thomas, C.D., Baxter, N., Block, C., Chikarmane, V., McGregor, P., Jentz, D., Hong, K., Hearne, S., Zhi, C., Zierath, D., Miner, B., Kuhn, M., Budrevich, A., Simka, H., Shankar, S.Year:
2001
Language:
english
DOI:
10.1109/iitc.2001.930081
File:
PDF, 453 KB
english, 2001