[IEEE 2010 5th International Microsystems, Packaging,...

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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Study on paddle delamination for quad flat no leads package

Lee, Chen-Hung, Lin, Lu-Fu, Ho, Tsung-Han, Cheng, Shi-Shiun, Tu, Hung-Hsu, Chang, Chin-Cheng
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Year:
2010
Language:
english
DOI:
10.1109/impact.2010.5699523
File:
PDF, 2.62 MB
english, 2010
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