[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Study on paddle delamination for quad flat no leads package
Lee, Chen-Hung, Lin, Lu-Fu, Ho, Tsung-Han, Cheng, Shi-Shiun, Tu, Hung-Hsu, Chang, Chin-ChengYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699523
File:
PDF, 2.62 MB
english, 2010