![](/img/cover-not-exists.png)
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Influence of thickness of interfacial IMC layer and solder mask layer on mechanical reliability of micro-scale BGA structure interconnects
Qin, Hong-Bo, Li, Xun-Ping, Zhang, Xin-PingYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474716
File:
PDF, 1.83 MB
english, 2012