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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Evaluation of the effect of stress relief slots on QFN strip warpage using finite element analysis
Cheng, Xiyun, Tan, Lin, Wang, Qian, Cai, Jian, Wang, Honghui, Wang, Xiaojiang, Zhang, Tonglong, Wang, Shuidi, Li, JinruiYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756530
File:
PDF, 800 KB
english, 2013