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[IEEE 2008 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2008.12.15-2008.12.17)] 2008 IEEE International Electron Devices Meeting - 3D stacked IC demonstration using a through Silicon Via First approach
Van Olmen, J., Mercha, A., Katti, G., Huyghebaert, C., Van Aelst, J., Seppala, E., Chao, Zhao, Armini, S., Vaes, J., Teixeira, R. Cotrin, Van Cauwenberghe, M., Verdonck, P., Verhemeldonck, K., JourdaiYear:
2008
Language:
english
DOI:
10.1109/iedm.2008.4796763
File:
PDF, 550 KB
english, 2008