[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation and measurement of the solder bumps with a plastic core
Schlobohm, J., Weide-Zaage, K., Rongen, R., Voogt, F., Roucou, R.Year:
2013
Language:
english
DOI:
10.1109/eurosime.2013.6529979
File:
PDF, 1.03 MB
english, 2013