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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting
Ding, Mian Zhi, Aw, Jie Li, Lim, Li Shiah, Wai, Leong Ching, Rao, Vempati SrinivasaYear:
2013
DOI:
10.1109/eptc.2013.6745717
File:
PDF, 1.66 MB
2013