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[IEEE 27th International Spring Seminar on Electronics Technology - Bankya, Bulgaria (13-16 May 2004)] 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. - Differences between solder bonds made with SnPbAg and SnAgCu solders
Tersztyanszky, L.Volume:
3
Year:
2005
Language:
english
DOI:
10.1109/isse.2004.1490858
File:
PDF, 648 KB
english, 2005