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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Line Edge Roughness (LER) correlation and dielectric reliability with Spacer-Defined Double Patterning (SDDP) at 20nm half pitch
Siew, Yong Kong, Stucchi, Michele, Versluijs, Janko, Roussel, Philippe, Kunnen, Eddy, Pantouvaki, Marianna, Beyer, Gerald P., Tokei, ZsoltYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940296
File:
PDF, 387 KB
english, 2011