[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Measuring the Strength of Brittle Microbeams Without Measuring Forces or Displacements
Hirshberg, A., Elata, D.Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1643990
File:
PDF, 316 KB
english, 2006