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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Molding void issue and solution of a Package-in-Package
Yu Chen,, Jian Cai,, Mian Huang,, Guanqiang Song,, Jing Jiang,, Lin Tan,, Qian Wang,Year:
2012
Language:
english
DOI:
10.1109/emap.2012.6507871
File:
PDF, 1.18 MB
english, 2012