[IEEE 2013 IEEE 22nd Conference on Electrical Performance...

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[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Characterization of TSVs by cascaded daisy chains

Wu, Yi-Chen, Wu, Kai-Bin, Yang, Kang-Yun, Huang, Ting-Yi, Wu, Ruey-Beei
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Year:
2013
Language:
english
DOI:
10.1109/epeps.2013.6703511
File:
PDF, 530 KB
english, 2013
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